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Return Material Authorisation  (RMA)

 
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Board-Level Products

Board-Level Products Photo Gallery

 

MIL-STD-1553B Adapter 8-Channel Serial I/O Adapter 4-Channel High-Speed Serial I/O Adapter 8-Channel High-Speed Serial I/O Adapter FDDI Adapter 1 Gbit/s Fibre Channel Adapter 2 Gbit/s Fibre Channel Adapter Dual Gigabit Ethernet Adapter Dual 4 Gbit/s Fibre Channel Adapter Dual 10 Gigabit Ethernet Adapter Adapter Performance Comparison

 

 Gigabit Ethernet and 10 Gigabit Ethernet Adapters (Fibre or Copper Media)

 High-Speed Serial I/O Adapters

 Other Serial I/O Adapters and Boards

 Digital I/O Boards

 FPGA Adapters

 Analog to Digital Converter Adapters and Boards

 FDDI and CDDI Adapters (100 Mbit/s, Dual Redundant)

 Multi-Function I/O Adapters

 Data Bus Adapters

 Special I/O Adapters

 Telecomms Adapters

 Universal Fibre Hub

 Single Board Computers

 Formfactor Converters

 Older Adapters, not for new designs

 Reports and White Papers

Available on request :
  • RLMT Switchover Time Measurement Report for the Dual Gigabit Ethernet Adapter VxWorks Enhanced Network Driver
  • Report on Gigabit Ethernet Adapter Software Driver Performance
  • Relex Reliability Predictions According to MIL-HDBK-217F SN2
  • Software Test Report for the 8-Channel High-Speed Serial I/O VxWorks Software Driver
  • Software Test Report for the 8-Channel High-Speed Serial I/O Linux Software Driver

 Manuals and Software Drivers

Terms and Conditions

Definitions


The following definitions apply :

    Advance :
    Describes a proposed product that is in the definition phase. There is no guarantee that the item will conform to the indicated specifications, nor that it will eventually be available as a production-quality product. 

    Preliminary :
    Describes a fully developed item, but one that is subject to production quality factors.


Product Ranges

Conduction-Cooled Range

Available in PMC, XMC and cPCI formfactors.

Ruggedised Grade

    -40 C to +85 C operation

    automotive and / or industrial grade components

    Polyimide PCBs (to MIL-PRF-55110F) with internal heat conduction layer and external EMC screening layers

    40 g (11 ms peak) shock, 0,1 g/Hz random vibration

    predicted MTBF figures provided

    individual functional testing

    individual pre-shipping digital photograph and test certificate

    environmental stress screening (ESS)

    conformal coating

Air-Cooled Range

Available in all formfactors.

Ruggedised Grade

    -40 C to +85 C operation

    automotive and / or industrial grade components

    Polyimide PCBs (to MIL-PRF-55110F) with internal heat management and external EMC screening layers

    40 g (11 ms peak) shock, 0,1 g/Hz random vibration

    epredicted MTBF figures provided

    individual functional testing

    individual pre-shipping digital photograph and test certificate

    environmental stress screening (ESS)

    conformal coating

Industrial Grade

    -15 C to +75 C operation

    industrial grade components

    FR4 PCBs (to IPC 6012 Class 3) with EMC screening layers

    30 g (11 ms peak) shock, 0,1 g/Hz random vibration

    predicted MTBF figures provided

    individual functional testing

Commercial Grade

    0 C to +55 C operation

    commercial components

    standard FR4 PCBs

    go-no-go functional testing

    Application Area per Formfactor :

    PMC

    :

    Commercial, Industrial, Ruggedised, Conduction-Cooled

    XMC

    :

    Commercial, Industrial, Ruggedised, Conduction-Cooled

    PCI-104

    :

    Commercial, Industrial, Ruggedised

    PCI-104 and PC/104-Plus

    :

    Commercial, Industrial, Ruggedised

    PCI

    :

    Commercial, Ruggedised