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Raytheon Missiles Systems Selects CI Systems's FDDI for RAM GMLS
Publication: CI Press Release Issued: Date: 2000-01-31 Reporter: CI Systems

CI Press Release

2000-01-31

CI Systems is pleased to announce that their FDDI PCI, PMC and CCPMC Adapter boards have been selected by Raytheon Missiles Systems of Tuscon, Arizona for application in the US Navy's and German Navy's RAM (Rolling Airframe Missile) surface-to-air Guided Missile Launch System (GMLS).

Rolling Airframe Missile (RAM) Guided Missile System

Detailed information on these products can be found at :

Raytheon Missile Systems, based in the Arizona city of Tuscon, has selected locally developed FDDI PCI (Peripheral Component Interconnect), PMC (PCI Mezzanine Card) and (Conduction-Cooled PCI Mezzanine Card) boards for application in its Rolling Airframe Missile (RAM) surface-to-air missile launchers.

The boards were developed by CI Systems, a Cape Town company specialising in real-time network-based solutions for mission-critical military and industrial applications, for inclusion in its Information Management System (IMS).

The IMS is a ship-borne combat system network based on SAFENET (Survivable Adaptable Fibre Optic Embedded Network) that effectively provides the logical integration function of the fight function of a ship. It can also be applied in real-time vectronics systems as well as tactical command and control systems.

CI Systemss FDDI, PMC and CCPMC boards conform to all relevant PCI and VITA standards. Highly robust and capable of operating under extreme environmental conditions, they are ideally suited for military and high-end industrial use.

The FDDI PMC board provides Class A connection and integrates directly into the dual FDDI ring. It is ideally suited to embedded platforms.

Conduction-cooling is a method of cooling active and passive components on a PCB (Printed Circuit Board) by direct heat conduction from an area of higher temperature to an area of lower temperature. Host carrier cards provide the thermal interface for the conduction-cooled PMC adapter by means of thermal ribs which conduct heat away from the PMC adapter.

Conduction-cooled modules are used wherever convection-cooling or forced-air cooling are not possible or are inappropriate for the end-use application. Conduction-cooled boards are particularly suitable for environments subject to high shock and vibration levels with the target applications being in rugged embedded systems.

The thermal interfaces on CI Systems CCPMC board have thermal vias densely packed to provide an effective heat path from the buried thermal layers in the PCB to the mating thermal interfaces on the surface of the CCPMC PCB.

The PMC FDDI adapter uses the AMD Supernet 3 FDDI chipset. This chipset offers advanced features such as Synchronous Bandwidth Allocation (SBA) and End Station Support (ESS). The adapter has an advanced ASIC onboard that performs buffer management and PCI interfacing, thereby achieving high throughput.

Together with Rochester Electronics and Advanced Micro Devices (AMD), CI Systems has a long-term supply plan for the AMD Supernet 2 and Supernet 3 FDDI chipsets, making FDDI and, in particular, CI Systemss FDDI NICs, an ideal choice for long-lived systems and programmes.

Other key features of the boards selected by Raytheon include:

  • High data transmission rate (100 Mbps), reliability data transfer efficiency and cost-effectiveness make FDDI the optimum solution for real-time and multimedia networks
  • Synchronous Bandwidth Allocator (SBA)
  • High-performance PCI data transfer
  • Two connector types available, SC or ST
  • Optical Bypass Switch Control
  • Fully software configurable
  • SMT Version 7.3